Electronic device including high-frequency transmission circuit

ABSTRACT

Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.

PRIORITY

This application is a Divisional Application of U.S. patent applicationSer. No. 16/939,708, filed on Jul. 27, 2020, which is a ContinuationApplication of U.S. patent application Ser. No. 15/621,687, filed onJun. 13, 2017, now U.S. Pat. No. 10,727,568, issued Jul. 28, 2020, andclaims priority under 35 U.S.C. § 119(a) to a Korean Patent Applicationfiled on Jun. 13, 2016 in the Korean Intellectual Property Office andassigned Serial No. 10-2016-0073355, the contents of each of which areincorporated herein by reference.

BACKGROUND 1. Field of the Disclosure

The present disclosure relates generally to a high-frequencytransmission circuit included in an electronic device, and moreparticularly, to a transmission line capable of effectively transmittinga noiseless high-frequency signal in a narrow space without affectingother modules.

2. Description of the Related Art

Recently, portable terminals having new functions have been rapidlydeveloped and have accounted for a greater part of people's lives withthe common use thereof.

Internal circuits of portable terminals are generally implemented onprinted circuit boards (PCBs). PCB technologies have been rapidlydeveloping, and flexible PCBs (FPCBs) that can be bent easily arecurrently used widely, as well as conventional rigid. PCBs.

In addition, coaxial cables are typically used for high-frequencytransmission lines (especially, radio frequency (RF) lines) that areapplied to wireless terminals. A large amount of additional materialcost may be required to produce coaxial cables used for electronicdevices as high-frequency transmission lines, and additional labor costmay be incurred by an increase in the number of assembly steps. Inanother example, electronic devices have narrow internal spacesavailable on account of various types of circuit modules mountedtherein, and due to the narrow internal spaces, a defect rate mayincrease when small connectors used for coaxial cables are assembled.

SUMMARY

An aspect of the present disclosure provides a transmission line capableof effectively transmitting a noiseless high-frequency signal in anarrow space without affecting other modules.

Another aspect of the present disclosure provides that a coaxial cableused as a transmission line in a portable terminal can be replaced by acircuit board that includes an FPCB, and thus it is possible toeliminate material costs associated with the manufacture of a coaxialcable.

Another aspect of the present disclosure provides a rigid PCB that isdisposed between transmission lines of an FPCB, whereby it is possibleto reduce line loss occurring in the transmission lines of the FPCB andto provide a high-frequency signal without loss.

Another aspect of the present disclosure provides that it is possible toefficiently use a mounting space in a wireless terminal, which enablesdiversification of the external design of the wireless terminal toimprove customer satisfaction.

In accordance with an aspect of the present disclosure, an electronicdevice is provided. The electronic device includes a first component, asecond component, and a signal path interface coupled between the firstcomponent and the second component, the signal path interface includinga PCB having a rigid PCB portion and a flexible PCB portion, wherein afirst signal line and a second signal line extend through the rigid PCBportion and the flexible PCB portion for transmitting signals from thefirst component to the second components, and a plurality of groundlines extend through the rigid PCB portion and the flexible PCB portion,and wherein each of the plurality of ground lines extending through therigid PCB portion is connected to one or more conductive layers throughconductive vias.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more apparent from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a front view of a high-frequency transmission line accordingto an embodiment of the present disclosure, in which a PCB in anelectronic device is used for the high-frequency transmission line;

FIG. 2 is a partial sectional view of a plurality of layers of the PCBof FIG. 1, according to an embodiment of the present disclosure, whereFIG. 2 is taken along line B-B′ of FIG. 1;

FIG. 3 is a sectional view of an interlayer configuration of a pluralityof layers of the PCB of FIG. 1, according to an embodiment of thepresent disclosure, where FIG. 3 is taken along line B-B′ of FIG. 1;

FIG. 4 is a front view of a high-frequency transmission line accordingto an embodiment of the present disclosure, where a PCB in an electronicdevice is used for the high-frequency transmission line;

FIG. 5 is a front view of a high-frequency transmission line accordingto an embodiment of the present disclosure, where a PCB in an electronicdevice is used for the high-frequency transmission line;

FIGS. 6A, 6B, 6C, 7A, 7B, and 7C are front views of conductive viasaccording to an embodiment of the present disclosure, the conductivevias being arranged in PCBs in electronic devices;

FIG. 8 is a perspective view of an electronic device according to anembodiment of the present disclosure;

FIG. 9 is a schematic of an antenna arrangement in an electronic deviceaccording to an embodiment of the present disclosure;

FIG. 10 illustrates an antenna device and a PCB in an electronic deviceaccording to an embodiment of the present disclosure;

FIG. 1 1 is an illustration of a signal transmission using a second PCBaccording to an embodiment of the present disclosure;

FIGS. 12 and 13 are enlarged views of a first FPCB and a first rigidPCB;

FIG. 14 is a block diagram of an electronic device according to anembodiment of the present disclosure in a network environment; and

FIG. 15 is a block diagram of an electronic device according to anembodiment of the present disclosure,

DETAILED DESCRIPTION OF EMBODIMENTS OF THE DISCLOSURE

Hereinafter, various embodiments of the present disclosure are describedwith reference to the accompanying drawings. However, it should beunderstood that there is no intent to limit the present disclosure tothe particular forms disclosed herein; rather, the present disclosure isintended to be construed to cover various modifications, equivalents,and/or alternatives of embodiments of the present disclosure. In thedescription of the accompanying drawings, similar reference numerals maybe used to designate similar elements.

As used. herein, the expressions “have”, “may have”, “include”, or “mayinclude” refer to the existence of a corresponding feature (e.g.,numeral, function, operation, or element such as a component), and donot exclude one or more additional features.

In the present disclosure, the expressions “A or B”, “at least one of Aand/or B”, and “one or more of A and/or B” may include all possiblecombinations of the items listed. For example, the expressions “A or B”,“at least one of A and B”, and “at least one of A or B” refer to all of(1) including at least one A, (2) including at least one B, and (3)including all of at least one A and at least one B.

The expressions “a first”, “a second”, “the first”, or “the second” usedin various embodiments of the present disclosure may modify variouscomponents regardless of the order and/or the importance of thecomponents but are not not intended to limit the correspondingcomponents. For example, a first user device and a second user deviceindicate different user devices although both of them are user devices.For example, a first element may be referred to as a second element, andsimilarly, a second element may be referred to as a first elementwithout departing from the scope of the present disclosure.

It should be understood that when an element (e.g., a first element) isreferred to as being (operatively or communicatively) “connected,” or“coupled,” to another element (e.g., a second element), the element maybe directly connected or directly coupled to the other element or anyother element (e.g., a third element) may be interposer between them. Incontrast, it may be understood that when an element (e.g., a firstelement) is referred to as being “directly connected,” or “directlycoupled” to another element (e.g., a second element), there is noelement (e.g., a third element) interposed between them.

The expression “configured to” used in the present disclosure may beused interchangeably with the expressions, for example, “suitable for”,“having the capacity to”, “designed to”, “adapted to”, “made to”, and“capable of” according to the situation. The term “configured to” maynot necessarily imply “specifically designed to” in hardware.Alternatively, in some situations, the expression “device configured to”may indicate that the device, together with other devices or components,“is able to”. For example, the expression “processor adapted (orconfigured) to perform A, B, and C” may indicate a dedicated processor(e.g., an embedded processor) only for performing the correspondingoperations or a general purpose processor (e.g., a central processingunit (CPU) or an application processor (AP)) that can perform thecorresponding operations by executing one or more software programsstored in a memory device.

The terms used herein are merely used for the purpose of describingparticular embodiments but are not intended to limit the scope of thepresent disclosure. A singular expression may include a pluralexpression unless they are definitely different in a context. Unlessdefined otherwise, all terms used herein, have the same meanings asthose commonly understood by a person skilled in the art to which thepresent disclosure pertains. Such terms as those defined in a generallyused dictionary may be interpreted to have the meanings equal to thecontextual meanings in the relevant field of art, and are not intendedto be interpreted to have ideal or excessively formal meanings unlessclearly defined in the present disclosure. In some cases, even the termsdefined in the present disclosure are not intended to be interpreted toexclude embodiments of the present disclosure.

An electronic device according to various embodiments of the presentdisclosure may include at least one of, for example, a smart phone, atablet personal computer (PC), a mobile phone, a video phone, anelectronic book reader (e-book reader), a desktop PC, a laptop PC, anetbook computer, a workstation, a server, a personal digital assistant(PDA), a portable multimedia player (PMP), a moving picture expertsgroup (MPEG-1) audio layer-3 (MP3) player, a mobile medical device, acamera, and a wearable device. According to various embodiments of thepresent disclosure, the wearable device may include at least one of anaccessory type (e.g., a watch, a ring, a bracelet, an anklet, anecklace, glasses, a contact lens, or a head-mounted device (HMD)), afabric or clothing integrated type (e.g., electronic clothing), abody-mounted type (e.g., a skin pad, or tattoo), and a bio-implantabletype (e.g., an implantable circuit).

According to an embodiment of the present disclosure, the electronicdevice may be a home appliance. A home appliance may include at leastone of, for example, a television, a digital video disk (DVD) player, anaudio player, a refrigerator, an air conditioner, a vacuum cleaner, anoven, a microwave oven, a washing machine, an air cleaner, a set-topbox, a home automation control panel, a security control panel, a TV box(e.g., Samsung HomeSync®, Apple TV®, or Google TV™), a game console(e.g., Xbox® and. PlayStation®), an electronic dictionary, an electronickey, a camcorder, and an electronic photo frame.

According to an embodiment of the present disclosure, the electronicdevice may include at least one of various medical devices (e.g.,various portable medical measuring devices (a blood glucose monitoringdevice, a heart rate monitoring device, a blood pressure measuringdevice, a body temperature measuring device, etc.), a magnetic resonanceangiography (MRA), a magnetic resonance imaging (MRI), a computedtomography (CT) machine, and an ultrasonic machine), a navigationdevice, a global positioning system (GPS) receiver, an event datarecorder (EDR), a flight data recorder (FDR), a vehicle infotainmentdevice, an electronic device for a ship (e.g., a navigation device for aship, and a gyro-compass), avionics, security devices, an automotivehead unit, a robot for home or industry, an automated teller machine(ATM), point of sales (POS) device in a shop, or an Internet of Things(IoT) device (e.g., a light bulb, various sensors, electric or gasmeter, a sprinkler device, a fire alarm, a thermostat, a streetlamp, atoaster, sporting goods, a hot water tank, a heater, a boiler, etc.).

According to an embodiment of the present disclosure, an electronicdevice may include at least one of a part of furniture or abuilding/structure, an electronic board, an electronic signaturereceiving device, a projector, and various types of measuringinstruments (e.g., a water meter, an electric meter, a gas meter, and aradio wave meter). An electronic device may be a combination of one ormore of the aforementioned various devices. An electronic device mayalso be a flexible device. Further, an electronic device is not intendedto be limited to the aforementioned devices, but may include anelectronic device to be developed in the future.

Hereinafter, an electronic device according to various embodiments ofthe present disclosure is described with reference to the accompanyingdrawings. In the present disclosure, the term “user” may indicate aperson using an electronic device or a device (e.g., an artificialintelligence electronic device) using an electronic device.

FIG. 1 is a front view of a high-frequency transmission line accordingto an embodiment of the present disclosure, in which a PCB 300 in anelectronic device is used for the high-frequency transmission line. Theelectronic device may be a smart phone or a wearable device.

Referring to FIG. 1., the electronic device may include a housingcorresponding to a case; a printed circuit unit including at least onePCB 300 in the housing; and an electrical path 350 passing over orthrough the printed circuit board 300.

The PCB 300 according to an embodiment of the present disclosure may bea first PCB 310 and a second PCB 320. For example, the first PCB 310 maybe a main board on which electronic components included in theelectronic device are mounted, the main board being capable oftransmitting signals between the electronic components, and the secondPCB 320 may be a sub-board that transmits signals generated by theelectronic components. The sub-board may further include the electroniccomponents.

The PCB 300 according to an embodiment of the present disclosure may beprovided with a circuit of a terminal, which may be, for example, atleast one of an AP, a communication processor (CP), a memory, and an RFtransceiver, and may include a signal line (for example, an RF signalline).

The first and second PCBs 310 and 320 according to an embodiment of thepresent disclosure may be formed of a plurality of layers, and theplurality of layers may include one or more conductive layers 306 inFIG. 2 described below and one or more insulation layers 303.

The first PCB 310 in FIG-. 1 according to an embodiment of the presentdisclosure may be a rigid PCB. The first PCB 310 may be electricallyconnected to the second PCB 320 through a connector 370. The connector370 may include a ground pad 390 and a signal pad 391 of the first PCB310 and a ground pad 392 and a signal pad 393 of the second PCB 320. Theground pad 390 of the first PCB 310 and the ground pad 392 of the secondPCB 320 may be connected together by soldering. The signal pad 391 ofthe first PCB 310 and the signal pad 393 of the second PCB 320 may beconnected together by soldering. The second PCB 320 may include aninterconnection pad 394. An antenna contact member (for example, aC-clip) or an RF component (for example, a matching circuit) may bemounted on the interconnection pad 394.

The second PCB 320 according to an embodiment of the present disclosuremay be connected to the first PCB 310 and may include an FPCB 330 or arigid PCB 340. The FPCB 330 and the rigid PCB 340 of the second PCB 320may be integrated with each other. For example, a first FPCB 331, afirst rigid printed circuit board 341,a second flexible printed circuitboard 332, and a second rigid PCB 342 may be arranged in sequence. Thesecond rigid PCB 342 may include an antenna connector and a universalserial bus (USB) connector, for example.

The second PCB 320 according to an embodiment of the present disclosuremay have the electrical path 350 therein through which electricalsignals can be transmitted. The electrical path 350 may be connectedwith the first PCB 310 through the FPCB 330 and the rigid PCB 340, whichare integrated with each other.

The electrical path 350 according to an embodiment of the presentdisclosure may extend from a first electrical component 230 in FIG. 10described below to a second electrical component 240 and may be disposedon or in the PCB 300 in FIG. 1. The electrical path 350 may beimplemented as a transmission line of a side-guarded micro-strip-linetype or a strip-line type, where the transmission line is shielded by aground line 360 in order to transmit a high-frequency signal, which maybe, for example, an RF signal.

The electrical path 350 according to an embodiment of the presentdisclosure, which is disposed on or in the second PCB 320, may receive ahigh-frequency signal through the connector 370 and may forward thereceived signal to antenna radiators 231 and 232 in FIG. 10 describedbelow. Furthermore, a plurality of electrical paths 350 in FIG. 1 may beprovided, and a ground line 360 may be disposed between the electricalpaths 350 so that the electrical paths 350 can independently transmitthe high-frequency signal without mutually affecting the characteristicsthereof.

The ground line 360 according to an embodiment of the present disclosuremay be disposed adjacent to the electrical path 350, and conductive vias305 may be arranged in a portion of the area of a ground line 360(a).Accordingly, the electrical path 350 can pass through the PCB 300without making contact with the conductive vias 305.

According to an embodiment of the present disclosure, the connector 370for connecting the electrical path 350 may be disposed between the firstand second PCBs 310 and 320 in order to transmit a high-frequency signaltherebetween. The connector 370 may include a soldering pad, a zip-typeconnector, or a B-to-B-type connector. A rigid PCB may be employed forthe connector 370, and, for example, a B-to-B-type connector may bemounted on the rigid printed circuit board, or a soldering pad may belocated on the rigid PCB. Furthermore, for example, the pin map of atransmission line included in the connector 370 may be implemented inthe sequence of a ground, an RF signal, and a ground.

Hereinafter, the plurality of layers and the conductive vias 305 of thePCB 300 is described in detail.

FIG. 2 is a partial sectional view of the plurality of layers of the PCBof FIG. 1, according to an embodiment of the present disclosure, whereFIG. 2 is taken along line B-B′ of FIG. 1. Hereinafter, the PCB isdescribed as the second PCB 320. However, the following description maybe applied to second printed circuit boards 420, 520, 620, and 720 inother embodiments, which will be described below.

Referring to FIG. 2, the second printed circuit board 320 according toan embodiment of the present disclosure may be formed of a plurality oflayers, each including at least one conductive layer 306, at least onefirst insulation layer 302, and at least one second insulation layer303. The conductive layer 306 and the first insulation layer 302 may beincluded in a flexible copper clad laminated (FCCL) layer. Further, thefirst insulation layer 302 may include polyamide.

The conductive layers 306 according to an embodiment of the presentdisclosure are arranged in the stacking direction, and the firstinsulation layer 302 is disposed on the rear or front surface of eachconductive layer 306. The individual layers may be alternately arranged.One or more conductive vias 305 may be formed to electrically connectthe conductive layers 306.

According to an embodiment of the present disclosure, the secondinsulation layer 303 is provided between the conductive layers 306 toprevent the conductive layers 306 from being electrically connectedtogether through contact therebetween. For example, the plurality ofsecond insulation layers 303 disposed between the plurality ofconductive layers 306 may function to insulate the layers and mayinclude a resin and a glass fabric.

According to an embodiment of the present disclosure, a plurality ofelectronic components may be disposed on and electrically connected tothe conductive layers 306. The electronic components may be electricallyconnected to the antenna radiators 231 and 232 in FIG. 10 describedbelow provided in the electronic device. For example, the electroniccomponents may include an antenna clip, a connector, and a switchdevice.

Without being limited thereto, however, various materials capable ofpassing electricity therethrough, other than metal, may be applied tothe conductive layers 306 in FIG. 2.

According to an embodiment of the present disclosure, the conductivelayers 306 may be electrically connected to any of a plurality of signallines and ground lines.

The conductive layers 306 according to an embodiment of the presentdisclosure may be provided, on the top and bottom thereof, with aprotective layer 301 capable of protecting the conductive layers 306.The protective layers 301 may be formed of an insulating coatingmaterial, such as solder resist, and, for example, a photo imageablesolder resist ink (PSR ink) may be used for the solder resist. The PSRink may be left on a product because it provides insulation andprotection even after a component is mounted. Accordingly; theprotective layers 301 coated on the exterior of the conductive layers306 can prevent a short circuit, a connection, corrosion, andcontamination of a circuit during a manufacturing process and canprotect the conductive layers 306 from external shock, humidity, andchemical substances after the manufacturing process.

The conductive vias 305 according to an embodiment of the presentdisclosure, which electrically connect the conductive layers 306, mayinclude a first conductive via 305(a) capable of electrically connectingall the layers and a second conductive via. 305(b) capable ofelectrically connecting adjacent layers. For example, the firstconductive via 305(a) may be formed by computerized numerical control(CNC) hole machining and copper plating, and the second conductive via305(b) may be formed by laser hole machining and copper plating.

The conductive vias 305 according to an embodiment of the presentdisclosure may include a region that forms a predetermined patternwithin the PCB 300. The conductive vias 305 may be configured to makecontact with at least one of the conductive layers 306 and to passthrough at least one of the multiple layers.

A pattern cover layer 304 according to an embodiment of the presentdisclosure may be disposed in a single layer on the bottom or top of theconductive layers 306 while surrounding a pattern and thus can protectthe internal pattern. For example, the pattern cover layer 304 may beformed of polyimide (PI) and an adhesive.

According to an embodiment of the present disclosure, rigid PCBs 380 and382 and a FPCB 381 may be integrated with one another. The FPCB 381 maynot include the second insulation layer 303, but may include the patterncover layer 304 instead of the protective layer 301.

FIG. 3 is a sectional view of an interlayer configuration of a pluralityof layers of the PCB of FIG. 1, according to an embodiment of thepresent disclosure, where FIG. 3 is taken along line B-B′ of FIG. 1.

Referring to FIG. 3, the second PCB 320 may include the first FPCB 331,the first rigid PCB 341, and the second FPCB 332, which are integrallyconnected together.

Further, the second PCB 320 may include first to fourth ground patternlayers 371, 372, 373, and 374 that are connected by the conductive vias305 in order to form a ground. The entirety of the first and secondground pattern layers 371 and 372 forms a ground. Only a part of thesecond and third ground pattern layers 372 and 373 forms a ground.According to an embodiment of the present disclosure, there may be alayer having no ground layer.

Signal line patterns 364 not connected to the ground may be provided.These signal line patterns 364 may be used as RF signal lines.

The ground pattern layers according to an embodiment of the presentdisclosure may be connected by the first conductive via 305(a) capableof electrically connecting all of the layers and the second conductivevia 305(b) capable of electrically connecting adjacent layers. Forexample, all or some of the ground pattern layers may be connected usingthe first conductive via 305(a) passing through all of the layers. Forexample, the first to fourth ground pattern layers 371, 372, 373, and374 may be connected by the first conductive via 305(a). The adjacentground pattern layers may be connected to each other by the secondconductive via 305(b). For example, the first and second ground patternlayers 371 and 372 may be connected to each other by the secondconductive via 305(b).

According to an embodiment of the present disclosure, a PCB (forexample, the PCB 300 of FIG. 1) may include the first PCB 310 and thesecond PCB 320 including a rigid PCB and a FPCB. In this case, the PCBis described as the PCB 300 of FIG. 1 as an example, but may be appliedto the PCBs 400, 500, 600, and 700 of FIGS. 4, 5, 6A, 6B, 6C. 7A, 7B,and 7C.

According to an embodiment of the present disclosure, the high-frequencytransmission line provided by the PCB in the electronic device may beconfigured such that the FPCB 330 having advantages of reducing amaterial cost and ensuring a mounting space can substitute for a coaxialcable.

For example, the first and second FPCBs 331 and 332 may be used betweenthe second rigid PCB 342 and the first PCB 310 in order to transmit ahigh-frequency signal from the second rigid PCB 342 to the first PCB310.

In another example, in order to eliminate loss that occurs when ahigh-frequency signal is transmitted using the FPCB 330, the first rigidPCB 341 may be disposed between the first and second FPCB 331 and 332,and the ground pattern layers may be connected by the conductive vias305.

According to an embodiment of the present disclosure, in order tomitigate an increase in line loss, the electronic device may furtherinclude a section containing the first rigid PCB 341 in the middle ofthe FPCB 330. If the FPCB 330 has a length of 10 mm or more, thetransmission line in the section may cause a great line loss. Forexample, the transmission line may have a change in the strip linecharacteristics due to the inductance generated by the ground lines 360disposed on the opposite sides thereof, and thus the line loss generatedby the electrical path 350 may increase markedly.

According to an embodiment of the present disclosure, the electronicdevice may have the one or more vias 305 arranged on the first rigid PCB341. When the grounds are connected by the conductive vias 305 arrangedon the first rigid PCB 341, the inductance generated by the ground lines360 can be reduced, for example, by virtue of the interlayer groundconnection on the ground lines 360, thereby reducing adverse effects,such as line loss. Furthermore, an all-ground layer (ground line) isdisposed between the layers providing the second PCB 320, and the entireground line 360 may be connected to the all-ground layer through theconductive vias 305, whereby it is possible to have a much greater lineloss reduction effect.

According to an embodiment of the present disclosure, a rigid PCB may bedisposed between the FPCBs, thereby preventing the layers from beingseparated or twisted as described above. In the case where the existingFPCBs are installed on a drive unit, the layers of the FPCBs may beseparated or twisted. Even in this case, there may be a change in thecharacteristics of a strip line, which may cause line loss in thetransmission line or other adverse property changes.

However, an electronic device having the aforementioned arrangement isadvantageous in that the side effects mentioned above are not exhibitedeven when the FPCBs move, whereby it is possible to reduce line loss inthe transmission line and to alleviate other adverse characteristics.

In addition, in the case where a transmission line has a greater length,it is possible to solve shortcomings, such as line loss, by additionallyplacing rigid PCBs in several positions on the FPCBs and using aconnection between the ground line 360, other ground pattern layers 363,and the conductive vias 305. This is described below in greater detailwith reference to FIG. 4.

FIG. 4 is a front view of a high-frequency transmission line accordingto an embodiment of the present disclosure, in which a PCB in anelectronic device is used for the high-frequency transmission line, Anelectronic device may be a smart phone or a wearable device.

According to an embodiment of the present disclosure, an electronicdevice may include a housing corresponding to a case; a printed circuitunit including at least one PCB 400 in the housing; and an electricalpath 450 passing aver or through the PCB 400.

Referring to FIG. 4, the PCB 400 according to an embodiment of thepresent disclosure may include a second PCB 420, a third PCB 411, and afourth PCB 412. For example, the third PCB 411 may be a main board onwhich electronic components included in an electronic device aremounted, the main board being capable of transmitting signals betweenthe electronic components. Furthermore, for example, the fourth PCB 412may be a main board on which electronic components included in anelectronic device are mounted, the main board being capable oftransmitting signals between the electronic components. Moreover, forexample, the second PCB 420 may be a sub-board that transmits signalsgenerated by electronic components. The sub-board may further includethe electronic components.

The PCB 400 according to an embodiment of the present disclosure may beprovided with a circuit of a terminal, which may be, for example, atleast one of an AP, a CP, a memory, and an RF transceiver, and mayinclude a signal line (for example, an RF signal line).

The second to fourth PCBs 420, 411, and 112 according to an embodimentof the present disclosure may be formed of a plurality of layers, andthe plurality of layers may include one or more conductive layers andone or more insulation layers.

The third and fourth PCBs 411 and 412 according to an embodiment of thepresent disclosure may be a rigid PCB. The third or fourth PCB 411 and412 may be electrically connected to the second PCB 410 through aconnector 470.

The third PCB 411 may be disposed on one end of the second PCB 420, andthe fourth PCB 412 may be disposed on an opposite end of the second PCB420. Hereinafter, the third and fourth printed circuit boards 411 and412 are described as third and fourth rigid PCBs 411 and 412,respectively

The third rigid PCB 411 according to an embodiment of the presentdisclosure may be connected with the second. PCB 420, and a firstconnector 471 may be disposed to transmit a high-frequency signalthrough the electrical path 450. The first connector 471 may include asoldering pad, a zip-type connector, or a B-to-B-type connector. A rigidPCB may be employed for the first connector 471, and, for example, aB-to-B-type connector may be mounted on the rigid PCB, or a solderingpad may be located on the rigid PCB. Furthermore, for example, the pinmap of a transmission line included in the first connector 471 may beimplemented in the sequence of a ground, an RF signal, and a ground.

The first connector 471 according to an embodiment of the presentdisclosure may include a ground pad 490 and a signal pad 491 of thethird rigid. PCB 411 and a ground pad 492 and a signal pad 493 of thesecond PCB 420. The ground pad 490 of the third rigid PCB 411 and theground pad 492 of the second PCB 420 may be connected together bysoldering. The signal pad 491 of the third rigid PCB 411 and the signalpad 493 of the second PCB 420 may be connected by soldering.

The fourth rigid PCB 412 according to an embodiment of the presentdisclosure may be connected to the second PCB 420, and a secondconnector 472 may be disposed to transmit a high-frequency signalthrough the electrical path 450. The second connector 472 may include asoldering pad, a zip-type connector, or a B-to-B-type connector. A rigidPCB may be employed for the second connector 472, and, for example, aB-to-B-type connector may be mounted on the rigid PCB, or a solderingpad may be located on the rigid PCB. Furthermore, for example, the pinmap of a transmission line included in the first connector 472 may beimplemented in the sequence of a ground, an RF signal, and a ground.

The second connector 472 according to an embodiment of the presentdisclosure may include a ground pad 495 and a signal pad 496 of thefourth rigid PCB 412 and a ground pad 497 and a signal pad 498 of thesecond PCB 420. The ground pad 495 of the fourth rigid PCB 412 and theground pad 497 of the second PCB 420 may be connected by soldering. Thesignal pad 496 of the fourth rigid PCB 412 and the signal pad 498 of thesecond PCB 420 may be connected by soldering. The second PCB 420 mayinclude an interconnection pad 494. An antenna contact member (forexample, a C-clip) or an RF component (for example, a matching circuit)may be mounted on the interconnection pad 494.

The second PCB 420 according to an embodiment of the present disclosuremay be disposed between the third rigid PCB 411 and the fourth rigid PCB412, and may include an FPCB 430 or a rigid PCB 440. The flexibleprinted circuit board 430 and the rigid PCB 440 of the second PCB 420may be integrated with each other. For example, a first FPCB 431, thefirst rigid PCB 440, and a second flexible PCB 432 may be arranged insequence. The first rigid PCB 440 may include an antenna connector and aUSB connector, for example.

The electrical path 450 according to an embodiment of the presentdisclosure may extend from a first electrical component including anantenna radiator to a second electrical component including acommunication circuit, and may be disposed on or in the PCB 400. Theelectrical path 450 may be implemented to be a transmission line of aside-guarded micro-strip-line type or a strip-line type, thetransmission line being shielded by a ground line in order to transmit ahigh-frequency signal, which may be, for example, an RF signal.

The electrical path 450 according to an embodiment of the presentdisclosure, which is disposed on or in the second PCB 420, may receive ahigh-frequency signal through the connector 470 and may forward thereceived signal to antenna radiators 231 and 232 in FIG. 10 describedbelow. Furthermore, a plurality of electrical paths 450 in FIG. 4 may beprovided, and a ground line 460 may be disposed between the electricalpaths 450 so that the electrical paths 450 can independently transmit ahigh-frequency signal without mutually affecting the characteristicsthereof.

The ground line 460 according to an embodiment of the present disclosuremay be disposed adjacent to the electrical path 450, and conductive vias405 may he arranged in a portion of the area of the ground line 460.Accordingly, the electrical path 450 can pass through the PCB 400without making contact with the conductive vias 405.

A plurality of layers of the PCB 400 and the conductive vias 405 are thesame as those in the above-described embodiment with reference to FIGS.1 to 3, and therefore descriptions thereof are omitted here.

FIG. 5 is a front view of a high-frequency transmission line accordingto an embodiment of the present disclosure, where a PCB in an electronicdevice is used for the high-frequency transmission line. The electronicdevice may be a smart phone or a wearable device.

Referring to FIG. 5. an electronic device may include a housingcorresponding to a case; a printed circuit unit including at least onePCB 500 in the housing; and an electrical path 550 passing over orthrough the PCB 500.

The PCB 500 according to an embodiment of the present disclosure mayinclude a first PCB 510 and a second PCB 520. For example, the first PCB510 may be a main board on which electronic components included in anelectronic device are mounted, the main board being capable oftransmitting signals between the electronic components, and the secondPCB 520 may be a sub-board on which the electronic components aremounted, the sub-board being capable of transmitting signals generatedby the electronic components. The sub-board may further include theelectronic components.

The PCB 500 according to an embodiment of the present disclosure may beprovided with a circuit of a terminal, which may be, for example, atleast one of an AP, a CP, a memory and an RF transceiver, and mayinclude a signal line (for example, an RF signal line).

The first and second PCBs 510 and 520 according to an embodiment of thepresent disclosure may be formed of a plurality of layers, and theplurality of layers may include one or more conductive layers and one ormore insulation layers.

The first PCB 510 according to an embodiment of the present disclosuremay be a rigid PCB. The first PCB 520 may be electrically connected tothe second PCB 510 through a connection unit 570. The first PCB 510 maybe connected to the second PCB 520, and the connector 570 may bedisposed to transmit a high-frequency signal through the electrical path550. The connector 570 may include a soldering pad, a zip-typeconnector, or a B-to-B-type connector. A rigid PCB may be employed forthe connector 570, and, for example, a B-to-B-type connector may bemounted on the rigid PCB, or a soldering pad may be located on the rigidPCB.

The connector 570 according to an embodiment of the present disclosuremay include a ground pad 590 and a signal pad 591 of the first PCB 510and a ground pad 592 and a signal pad 593 of the second PCB 520. Theground pad 590 of the first PCB 510 and the ground pad 592 of the secondPCB 520 may be connected by soldering. The signal pad 591 of the firstPCB 510 and the signal pad 593 of the second PCB 520 may be connectedtogether by soldering. The second PCB 520 may include an interconnectionpad 594. An antenna contact member (for example, a C-clip) or an RFcomponent (for example, a matching circuit) may be mounted on theinterconnection pad 594.

The second PCB 520 according to an embodiment of the present disclosuremay include an FPCB 530 and a rigid PCB 510 that are integrated witheach other. For example, the second PCB 520 may include a first FPCB531, a first rigid PCB 541, and a second FPCB 532, which are arranged insequence. The second FPCB 532 may include an antenna connector and a USBconnector. Unlike in an embodiment described above with reference toFIG. 1, the second FPCB 532 in FIG. 5 is configured to perform thefunction of the second rigid PCB 342 in FIG. 1 as well.

The electrical path 550 in FIG. 5 according to an embodiment of thepresent disclosure may extend from a first electrical componentincluding an antenna radiator to a second electrical component includinga communication circuit, and may be disposed on or in the PCB 500. Theelectrical path 550 may be implemented to be a transmission line of aside-guarded micro-strip-line type or a strip-line type, thetransmission line being shielded by a ground line in order to transmit ahigh-frequency signal, which may be, for example, an RF signal.

The electrical path 550 according to an embodiment of the presentdisclosure, which is disposed on or in the second PCB 520, may receive ahigh-frequency signal through the connector 570 and may forward thereceived signal to an antenna radiator. Furthermore, a plurality ofelectrical paths 550 may be provided, and a ground line 560 may bedisposed between the electrical paths 550 so that the electrical paths550 can independently transmit the high-frequency signal withoutmutually affecting the characteristics thereof.

The ground line 560 according to an embodiment of the present disclosuremay be disposed adjacent to the electrical path 550, and conductive vias505 may be arranged in a portion of the area of the ground line 560.Accordingly, the electrical path 550 can pass through the PCB 500without making contact with the conductive vias 505.

A plurality of layers of the PCB 500 and the conductive vias 505 are thesame as those in an above-described embodiment with reference to FIGS. 1to 3, and therefore descriptions thereof are omitted here.

FIGS. 6A, 6B, and 6C are front views of conductive vias according to anembodiment of the present disclosure, the conductive vias being arrangedin electronic device PCBs. FIGS. 6A, 6B, and 6C illustrate various formsof PCBs.

Referring to FIG. 6A, a second PCB 620 according to an embodiment of thepresent disclosure may include an FPCB 630 and a rigid PCB 640, whichare integrated with each other. For example, the second PCB 620 mayinclude a first FPCB 631, the first rigid PCB 640, and a second FPCB632, which are arranged in sequence.

An electrical path 650 according to an embodiment of the presentdisclosure may be disposed on or in the second PCB 620 and may beimplemented to be a transmission line of a side-guarded micro-strip-linetype or a strip-line type in order to transmit a high-frequency signal.

The electrical path 650 according to an embodiment of the presentdisclosure, which is disposed on or in the second PCB 620, may receive ahigh-frequency signal through a connector and may forward the receivedsignal to an antenna radiator. Furthermore, a plurality of electricalpaths 650 may be provided, and a ground line 660 may be disposed betweenthe electrical paths 650 so that the electrical paths 650 canindependently transmit the high-frequency signal without mutuallyaffecting the characteristics thereof.

The ground lines 660 according to an embodiment of the presentdisclosure may be disposed adjacent to the electrical path 650 and maybe connected with one or more conductive layers through conductive vias605(c) in the PCB. Since the conductive vias 605(c) are arranged in oneground line 660, the electrical path 650 may pass through the PCBwithout making contact with the conductive vias 605(c).

The electrical path 650 according to an embodiment of the presentdisclosure is disposed to pass through the flexible PCB 630 and therigid PCB 640, and thus the ground lines 660 disposed on opposite sidesof the electrical path 650 may also be disposed to pass through the FPCB630 and the rigid PCB 640. While two ground lines 660 are provided inFIG. 6A, the number of ground lines 660 may be diversely varied so as toavoid contact with the electrical path 650, without being limitedthereto.

For example, the first ground line 660(a) disposed on the left side mayhave a greater width than the second ground. line 660(b) disposed on theright side, and the plurality of conductive vias 605(c) may be formed inthe region where the rigid PCB 640 and the ground line 660(a) cross eachother. The second ground line 660(b) may not include the conductive vias605(c) since the second ground line 660(b) has a lesser width than thefirst ground line 660(a).

The PCB is illustrated as having the conductive vias 605(c) arranged inthe first ground line 660(a) having a great width. The conductive vias605(c) arranged in the first ground line 660(a) may include vias passingthrough all layers. Ground patterns in all or some of the layers and theground line on a side of the electrical path may be connected by theconductive vias 605(c) passing through all the layers.

Referring to FIG. 6B, ground lines 660 may be separately disposed onopposite sides of an electrical path 650 in the second PCB 620 and maybe formed to pass through the flexible PCB and the rigid PCB along thelengthwise direction of the electrical path 650. While the two groundlines 660 are provided in FIG. 6B, the number of ground lines 660 may bediversely varied so as to avoid contact with the electrical path 650,without being limited thereto.

According to an embodiment of the present disclosure, the first groundline 660(a) disposed on the left side may have a greater width than thesecond ground line 660(b) disposed on the right side, and a plurality ofconductive vias 605(c) may be formed in the region where the firstground line 660(a) and the rigid PCB 640 cross each other. The secondground line 660(b) on the right side may not include the conductive vias605(c) having the size since the second ground line 660(b) has a lesserwidth than the first ground line 660(a). Instead, the second ground line660(b) on the right side may have conductive vias 605(d) having a lessersize than the conductive vias 605(c).

For example, the rigid PCB 640 formed of a plurality of layers mayinclude the third conductive vias 605(c) passing through all of thelayers in the PCB and the fourth conductive vias 605(d) passing throughsome of the layers. The third conductive vias 605(c) may have a greaterhole size than the fourth conductive vias 605(d) passing through some ofthe layers, and may be arranged in the ground line 660(a) having a greatwidth. However, the fourth conductive vias 605(d) may be arranged in thesecond ground line 660(b) having a lesser width and disposed on theright side, since the fourth conductive vias 605(d) have a lesser holesize than the third conductive vias 605(c). Even when the ground lines660 are connected with a ground in a different layer through someconductive vias 605. it is possible to reduce line loss.

Referring to FIG. 6C, ground lines 660 may be separately disposed onopposite sides of an electrical path 650 and may be formed in thelengthwise direction of the electrical path 650. While two ground lines660 are provided in FIG. 6C, the number of ground lines 660 may bediversely varied so as to avoid contact with the electrical path 650,without being limited thereto.

According to an embodiment of the present disclosure, the first groundline 660(a) disposed on the left side may have a lesser width than thesecond ground line 660(b) disposed on the right side, and a plurality ofconductive vias 605(d) may be formed in the region where the secondground line 660(b) and the rigid PCB 640 cross each other. The secondground line 660(b) on the right side has a greater width than the firstground line 660(a), but is too narrow to have the great conductive vias605(c). Instead, the conductive vias 605(d) having a lesser width may bearranged in the second ground line 660(b) on the right side.

Therefore, according to an embodiment of the present disclosure, thesecond ground line 660(b) having a lesser width and disposed on theright side may electrically connect the PCB using the fourth conductivevias 605(d) passing through some layers. Even when the ground lines 660are connected with a ground in a different layer through some of thefourth conductive vias 605(d), it is possible to reduce line loss.

FIGS. 7A, 7B, and 7C are top views illustrating conductive vias arrangedin PCBs according to an embodiment of the present disclosure. FIGS. 7A,7B, and 7C illustrate various forms of PCBs.

Referring to FIG. 7A, a second PCB 720 may include a plurality of FPCBsand/or a plurality of rigid PCBs. For example, the second PCB 720 may beconfigured such that FPCBs 730 and rigid PCBs 740 are alternatelydisposed and are integrated with each other.

The FPCBs 730 according to an embodiment of the present disclosure mayinclude a first FPCB 731, a second FPCB 732, and a third FPCB 733. Therigid PCBs 740 may include a first rigid PCB 741 and a fifth rigid PCB742.

According to an embodiment of the present disclosure, at least two rigidPCBs 740 may be provided between the FPCBs 730. For example, the secondPCB 720 may include the first FPCB 731, the first rigid PCB 741, thesecond FPCB 732, the fifth rigid PCB 742, and the third FPCB 733, whichare arranged in sequence.

The first and fifth rigid PCBs 741 and 742 may be disposed to be spacedapart from each other and may include a plurality of conductive vias705(c) and ground lines 760.

An electrical path 750 according to an embodiment of the presentdisclosure may be disposed on or in the second PCB 720 and may beimplemented to be a transmission line of a side-guarded micro-strip-linetype or a strip-line type in order to transmit a high-frequency signal.

The electrical path 750 according to an embodiment of the presentdisclosure, which is disposed on or in the second PCB 720, may receive ahigh-frequency signal through a connector and may forward the receivedsignal to an antenna radiator. Furthermore, a plurality of electricalpaths 750 may be provided, and the ground line 760 may be disposedbetween the electrical paths 750 so that the electrical paths 750 canindependently transmit the high-frequency signal without mutuallyaffecting the characteristics thereof.

The ground lines 760 according to an embodiment of the presentdisclosure may be disposed adjacent to the electrical path 750 and maybe connected with one or more conductive layers through the conductivevias 705(c) in the PCB 720.

The ground lines 760 according to an embodiment of the presentdisclosure may be formed to pass through the FPCB 730 and the rigid PCBs740 along the lengthwise direction of the electrical path 750. While twoground lines 760 are provided in the present disclosure, the number ofground lines 760 may be diversely varied so as to avoid contact with theelectrical path 750, without being limited thereto.

For example, the first ground line 760(a) disposed on the left side ofthe first and fifth rigid PCBs 741 and 742 may have a greater width thanthe second ground line 760(b) disposed on the right side, and theplurality of conductive vias 705(c) may be formed in the regions wherethe first ground line 760(a) crosses the first and fifth rigid PCBs 741and 742. In another example, the second ground line 760(b) on the rightside may not include the conductive vias 705(c) having the size sincethe second ground line 760(b) has a lesser width than the first groundline 760(a). The PCB is illustrated as having the conductive vias 705(c)arranged in the first ground line 760(a) having a great width.

Referring to FIG. 7B, the second PCB 720 may include the FPCBs 730 andthe rigid PCBs 740 that are integrated with each other. For example, thesecond PCB 720 may be configured such that the FPCBs 730 and the rigidPCBs 740 are alternately disposed and are integrated with each other.

The second PCB 720 according to an embodiment of the present disclosuremay include the first FPCB 731, the first rigid PCB 741, the second.FPCB 732, the fifth rigid PCB 742, and the third FPCB 733, which arearranged in sequence.

Ground lines 760 according to an embodiment of the present disclosuremay be separately disposed on opposite sides of the electrical path 750and may be formed along the lengthwise direction of the electrical path750. While two ground lines 760 are provided in the FIG. 7B, the numberof ground lines 760 may be diversely varied so as to avoid contact withthe electrical path 750, without being limited thereto.

According to an embodiment of the present disclosure, the first groundline 760(a) disposed on the left side of the first and fifth rigid PCBs741 and 742 may have a greater width than the second ground line 760(b)disposed on the right side, and a plurality of conductive vias 705(c)may be formed in the regions where the first ground line 760(a) crossesthe rigid PCBs 740. However, the second ground line 760(b) on the rightside may not include the conductive vias 705(c) having the size sincethe second ground line 760(b) has a lesser width than the first groundline 760(a). Instead, the second ground 760(b) on the right side mayhave conductive vias 705(d) having a lesser size than the conductivevias 705(c).

For example, the rigid PCBs 740 formed of a plurality of layers mayinclude the third conductive vias 705(c) passing through all the layersin the PCB and the fourth conductive vias 705(d) passing through some ofthe layers. The third conductive vias 705(c) may have a greater holesize than the fourth conductive vias 705(d) passing through some of thelayers, and may be arranged in the ground line 760(a) having a greatwidth. However, the fourth conductive vias 705(d) may be arranged in thesecond ground line 760(b) having a lesser width and disposed on theright side, since the fourth conductive vias 705(d) have a lesser holesize than the third conductive vias 705(c). Even when the ground lines760 are connected with a ground in a different layer through someconductive vias 705, it is possible to reduce a line loss.

Referring to FIG. 7C, the second PCB 720 may include the FPCBs 730 andthe rigid PCBs 740 that are alternately disposed and are integrated witheach other. In this embodiment, at least two rigid PCBs 740 may beprovided between the FPCBs 730. For example, the second PCB 720 mayinclude the first FPCB 731, the second. FPCB 732, the first rigid PCB741, the fifth rigid PCB 742, and the third FPCB 733, which are arrangedin sequence.

Ground lines 760 according to an embodiment of the present disclosuremay be separately disposed on opposite sides of the electrical path 750and may be formed along the lengthwise direction of the electrical path750. While two ground lines 760 are provided in the present disclosure,the number of ground lines 760 may be diversely varied so as to avoidcontact with the electrical path 750, without being limited thereto.

According to an embodiment of the present disclosure, the first groundline 760(a) disposed on the left side of the first and fifth rigid PCBs741 and 742 may have a lesser width than the second ground line 760(b)disposed on the right side, and a plurality of conductive vias 705(d)may be formed in the regions where the second ground line 760(b) crossesthe rigid PCBs 740. The second ground line 760(b) on the right side hasa greater width than the first ground line 760(a), but is too narrow tohave the great conductive vias 705(c). Instead, the conductive vias705(d) having a lesser width may be arranged in the second ground line760(b) on the right side.

Therefore, according to an embodiment of the present disclosure, evenwhen the ground lines 760 are connected to a ground in a different layerthrough some of the fourth conductive vias 705(d) arranged in the secondground line 760(b), it is possible to reduce a line loss.

FIG. 8 is a perspective view of an electronic device according to anembodiment of the present disclosure. The electronic device 10 may be asmart phone or a wearable device. The electronic device 10 may be anelectronic device that includes the PCBs described above with referenceto FIGS. 1 to 7.

Referring to FIG. 8, a display 101 may be mounted on the front 107 ofthe electronic device 10. A speaker device 102 for receiving acounterpart's speech may be provided on the upper side of the display101. A microphone device 103 for transmitting the speech of a user ofthe electronic device 10 to the counterpart may be provided on the lowerside of the display 101.

According to an embodiment of the present disclosure, one or morecomponents for performing various functions of the electronic device 10may be arranged around the speaker device 102. For example, the one ormore arranged components may include at least one sensor module 104. Thesensor module 101 may include, for example, at least one of anilluminance sensor (e.g., an optical sensor), a proximity sensor, aninfrared sensor, and an ultrasonic sensor. The components may alsoinclude a camera device 105. The components may also include a lightemitting diode (LED) indicator 106 for informing a user of statusinformation of the electronic device 10.

According to an embodiment of the present disclosure, the electronicdevice 10 may include a metal bezel 110 (for example, capable of servingas at least a part of a metal housing). The metal bezel 110 may bedisposed along the outer periphery of the electronic device 10 and mayextend to at least one area of the back of the electronic device 10, theat least one area being connected to the outer periphery. The metalbezel 110 may define the thickness of the electronic device 10 along theouter periphery of the electronic device 10 and may be formed in a loopshape. Without being limited thereto, however, the metal bezel 110 mayalso be formed in such a manner that the metal bezel contributes to atleast part of the thickness of the electronic device 10. The metal bezel110 may also be disposed only in at least one area of the outerperiphery of the electronic device 10. The metal bezel 110 may includeone or more cut-off portions 115 and 116. Unit bezel parts separated bythe cut-off portions 115 and 116 may be used as an antenna radiator thatoperates in at least one frequency band.

According to an embodiment of the present disclosure, the metal bezel110 may have a loop shape along the outer periphery of the electronicdevice and may be disposed to contribute to the entirety or a part ofthe thickness of the electronic device 10. When the electronic device 10is viewed from the front, the metal bezel 110 may include a right bezelpart 111, a left bezel part 112, an upper bezel part 113, and a lowerbezel part 114. In this case, the lower bezel part 114 described abovemay serve as a unit bezel part formed by a pair of cut-off portions 116.

According to an embodiment of the present disclosure, a main antennadevice may be disposed in the lower region (an antenna region of a mainpart) of the electronic device 10. The lower bezel part 114 may be usedas a main antenna radiator by virtue of the pair of cut-off portions116. The lower bezel part 114 may serve as an antenna radiator thatoperates in at least two operating frequency bands depending on thefeeding position. For example, the lower bezel part 114 may be a part ofan antenna that supports a low band (LB) and a high/middle band (H/MB),or a part of an antenna that supports an H/MB.

According to an embodiment of the present disclosure, the antenna deviceof the present disclosure is simply for illustrative purpose, and theaforementioned functions of the lower bezel part 114 may be performed bythe upper bezel part 113 separated by the other cut-off portions 115, ormay be performed by the upper and lower bezel parts.

According to an embodiment of the present disclosure, an antenna regionof a diversity part may be used as an antenna for diversity/multipleinput multiple output (MIMO). For example, the upper bezel part 113 maybe a part of a diversity antenna that supports LB and H/MB.

According to an embodiment of the present disclosure, at least one ofthe right and left bezel parts 111 and 112 may be supplied withelectrical power to operate as an antenna. For example, the right orleft bezel part 111 or 112 may be a part of an antenna that supports anH/MB band or LB and H/MB bands. For example, an antenna including theright or left bezel part 111 or 112 included in the antenna region ofthe main part may operate as a main antenna. An antenna including theright or left bezel part 111 or 112 included in the antenna region ofthe diversity part may operate as a diversity antenna. Hereinafter, theconfiguration of an antenna is described in detail.

FIG. 9 is a schematic of an antenna arrangement in an electronic device10 according to an embodiment of the present disclosure. The electronicdevice 10 may be a smart phone or a wearable device. The electronicdevice 10 may be an electronic device that includes the PCBs describedabove with reference to FIGS. 1 to 7.

The electronic device 10 according to an embodiment of the presentdisclosure may include a plurality of antenna radiators 230. Forexample, the electronic device 10 may include first and second antennas231 and 232 of a main part 210 and third and fourth antennas 233 and 234of a diversity part 220.

The first antenna 231 may support LB and H/MB bands, and the secondantenna 232 may support an Fl/MB band. According to an embodiment of thepresent disclosure, an LB band has a relatively great wavelength so thatan antenna may have a relatively great size, and there may be a mountingspace limitation by adding an antenna supporting multiple LBs to themain part 210 of the terminal. Therefore, only one antenna may beconfigured to support an LB band.

In the case where the electronic device 10 additionally has thediversity part 220 according to an embodiment of the present disclosure,the electronic device 10 may include the third and fourth antennas 233and 234. In order to enhance correlation/isolation characteristics, theantenna radiators 230 of the main part 210 may be included in the lowerend portion of the terminal, and the antenna radiators 230 of thediversity part 220 may be included in the upper end portion of theterminal. For example, in the case where the antenna radiators 230 ofthe main part 210 are included in the lower end portion of the terminal,and the antenna radiators 230 of the diversity part 220 are included inthe upper end portion of the terminal, it is possible to ensure anantenna separation distance available in the terminal even when aplurality of LB band antennas are included.

By virtue of the structure described above, the electronic device 10 canreceive signals using four antennas in an H/MB band and can receivesignals using two antennas in an LB band. That is, 4th orderdiversity/MIMO can be performed in an H/MB band, and 2nd orderdiversity/M1MO can be performed in an LB band.

FIG. 10 illustrates an antenna device and a PCB of an electronic deviceaccording to an embodiment of the present disclosure. Referring to FIG.10, a main RF circuit in the main part 210 may supply electrical powerto the first and second antennas 231 and 232 connected thereto throughthe connector 370 and the second PCB 320 using RF signal lines. Thesecond PCB 320 may include the first FPCB 331, the first rigid PCB 341,the second FPCB 332, and the second rigid PCB 342. A ground may beremoved from an antenna feeding part or from the surroundings of anantenna in order to enhance antenna characteristics.

According to an embodiment of the present disclosure, the metal bezel110 may include the right bezel part 111, the left bezel part 112, theupper bezel part 113, and the lower bezel part 114 when viewed from thefront. The upper bezel part 113 may be maintained separately from theright and left bezel parts 111 and 112 by a pair of cut-off portionsthat are formed with a predetermined interval therebetween. The lowerbezel part 114 may be maintained separately from the right and leftbezel parts 111 and 112 by a pair of cut-off portions that are formedwith a predetermined interval therebetween. The pair of cut-off portionsmay be formed. of a dielectric material. The pair of cut-off portionsmay be formed by double-injection molding or insert molding a syntheticresin into the metal bezel. Without being limited thereto, however,various types of electrical insulating materials may be applied to thepair of cut-off portions.

According to an embodiment of the present disclosure, a first feedingpiece may be integrally formed with the lower bezel part 114 and may besupplied with electrical power by a first feeding part of the PCB. Thefirst feeding piece of the lower bezel part 114 may be connected to thefirst feeding part of the PCB merely by installing the PCB in theelectronic device, or may be electrically connected to the first feedingpart by a separate electrical connection member (e.g., a C-clip, etc.).

According to an embodiment of the present disclosure, a first feedingpad may be disposed on the PCB and may be electrically connected to thefirst feeding piece of the lower bezel part 114. A first electrical path(e.g., an interconnection wire line) may be formed from the firstfeeding pad to the first feeding part. The first feeding piece may beintegrally formed with the lower bezel part 114 and may be supplied withelectrical power by the first feeding part of the PCB. The first feedingpiece of the lower bezel part 114 may be connected to the first feedingpart of the PCB merely by installing the PCB in the electronic device,or may be electrically connected to the first feeding part by a separateelectrical connection member (e.g., a C-clip, etc.).

According to an embodiment of the present disclosure, the first feedingpad may be disposed on the PCB and may be electrically connected to thefirst feeding piece of the lower bezel part 114. The first electricalpath (e.g., an interconnection wire line) may be formed from the firstfeeding pad to the first feeding part.

The lower bezel part may be a portion of the first antenna 231 of themain part 210 that supports an LB or H/MB band. The left and right bezelparts 112 and 111 may also be supplied with electrical power by the samemethod. The left and right bezel parts 112 and 111 may be portions ofthe second antenna 231 of the main part 210 that supports an LB or H/MBband.

According to an embodiment of the present disclosure, a first electricalconnection piece may be integrally formed with the lower bezel part 114so as to be located at a position separate from the, first feeding pieceby a predetermined distance, and may be grounded to a first ground partof the PCB. The first electrical connection piece of the lower bezelpart 114 may be grounded to the first ground part of the PCB merely byinstalling the PCB in the electronic device, or may be electricallyconnected to the first ground part by a separate electrical connectionmember (e.g., a C-clip, etc.).

According to an embodiment of the present disclosure, a first ground padmay be disposed on the PCB and may be electrically connected to thefirst electrical connection piece of the lower bezel part 114. A secondelectrical path (e.g., an interconnection wire line) may be formed fromthe first ground pad to the first ground part.

According to an embodiment of the present disclosure, a second feedingpiece may be integrally formed with the lower bezel part 114 and may besupplied with electrical power by a first feeding part of the PCB. Thesecond feeding piece of the lower bezel part 114 may be connected to asecond feeding part of the PCB merely by installing the PCB in theelectronic device, or may be electrically connected to the secondfeeding part by a separate electrical connection member (e.g., a C-clip,etc.).

According to an embodiment of the present disclosure, a second feedingpad may be disposed on the PCB and may be electrically connected to thesecond feeding piece of the lower bezel part 114. A third electricalpath (e.g an interconnection wire line) may be formed from the secondfeeding pad to the second feeding part. The lower bezel part 114 may bea portion of the second antenna 232 of the main part 210 that supportsan LB or H/MB band.

According to an embodiment of the present disclosure, a secondelectrical connection piece may be integrally formed with the rightbezel part 111 so as to be located at a position separate from thecut-off portions by a predetermined distance, and may be grounded to asecond ground part of the PCB. The second electrical connection piece ofthe right bezel part 111 may be grounded to a second ground part of thePCB merely by installing the PCB in the electronic device, or may beelectrically connected to the second ground part by a separateelectrical connection member (e.g., a C-clip, etc.),

According to an embodiment of the present disclosure, a second groundpad may be disposed on the PCB and may be electrically connected to thesecond electrical connection piece of the right bezel part 111. A fourthelectrical path (e.g., an interconnection wire line) may be formed fromthe second ground pad to the second ground part.

For example, the feeding parts, the feeding pads, the ground parts, andthe ground pads of the main part 210 may be disposed on the second PCB320. The main part 210 and an RF circuit of the diversity part 220 maybe disposed on the first PCB (main PCB) 310. The first and second PCBsmay be connected by an FPCB. The first and second PCBs may be integratedwith each other.

According to an embodiment of the present disclosure, the second rigidPCB 342 included in the second PCB 320 may be disposed at a lowervertical position than the first PCB (main PCB) 310. Accordingly,components included in the second rigid PCB 342 may be additionallyspaced apart from the antenna. Further, relatively thick components,such as a USB connector and a speaker, can also be disposed on thesecond rigid PCB 342.

According to an embodiment of the present disclosure, a transmitted orreceived signal of the RF circuit of the main part 210 may be forwardedto the first and second feeding parts of the second PCB 320.

The diversity part 220 may include the third and fourth antennas 233 and234. The third antenna 233 may include a part of the upper bezel part113, and the fourth antenna 234 may include the left or right bezel part112 or 111.

The third antenna 233 may support LB and H/MB bands, and the fourthantenna 234 may support an II/MB band, Feeding parts, feeding pads,ground parts, and ground pads of the diversity part 220 may be disposedon the first PCB (main PCB) 310. Electrical paths connecting the feedingparts and the feeding pads and electrical paths connecting the groundparts and the ground pads in the diversity part 220 may be disposed onthe first PCB (main PCB) 310.

According to an embodiment of the present disclosure, when the main part210 uses the right bezel part 111 as the second antenna 232 for thepurpose of signal separation between the antennas, the diversity part220 may use the opposite left bezel part 112 as the fourth antenna 234.Alternately, when the main part 210 uses the left bezel part 112 as thesecond antenna 232, the diversity part 220 may use the opposite rightbezel part 111 as the fourth antenna 234.

FIG. 11 is an illustration of a signal transmission using the second PCB320 according to an embodiment of the present disclosure. The second PCB320 may be the same as the second PCBs 320, 420, and 520 described abovewith reference to FIGS. 1 to 7.

Referring to FIG. 11, the second. PCB 320 may include the FPCB 330 andthe rigid PCB 340, which are integrated with each other. The second PCB320 ma include the first FPCB 331, the second. FPCB 332, the first rigidPCB 341, and the second rigid PCB 342.

According to an embodiment of the present disclosure, the electricalpath 350 for transmitting a high-frequency signal may also transmitsignals other than RF signals using the second PCB 320. The othersignals may include, for example, a USB an ear-jack signal, a microphone(MIC) signal, a speaker signal, and a touch key signal.

According to an embodiment of the present disclosure, an antenna contactto which an RF signal is connected, and a USB connector, an ear-jackconnector, a microphone (MIC) connector, and a speaker contact to whichthe other signals are connected may be disposed on the second rigid PCB342. For example, RF signals may be transmitted through two electricalpaths 350: the first electrical path 351 and the second electrical path352. The ground line 360 may be disposed between the first and secondelectrical paths 351 and 352 to prevent the first and second electricalpaths 351 and 352 from mutually affecting the characteristics thereof.The conductive vias 305 may be arranged in the region where the groundline 360 and the first rigid PCB 341 cross each other, and may beconnected to a ground in a different layer. A rigid PCB connected to therear end of the second rigid PCB 342 may be various types of modules ofthe electronic device, and may function as a touch key, for example.

According to an embodiment of the present disclosure, a first connector342(a) connected to the first electrical path 351 may be a first antennacontact, a first USB connector, a first ear-jack connector, a first MICconnector, or a first speaker contact, and a second connector 342(b)connected to the second electrical path 352 may be a second antennacontact, a second USB connector, a second ear-jack connector, a secondMIC connector, and a second speaker contact.

FIGS. 12 and 13 are enlarged views of a first FPCB and a first rigidPCB. The second PCB 320 may be one of the second PCBs 320, 420, 520,620, and 720 described above with reference to FIGS. 1 to 7.

Referring to FIGS. 12 and 13. a high-frequency signal may be connectedfrom a B-to-B-type connector A of the connector 370 to antenna (ANT)feeding B and C by a micro strip line or a strip line on the FPCB.Further, the ground lines 306 may exist on the left and right sides ofthe electrical path 350 through which an RF signal is transmitted on theconnector, and may be formed parallel to the electrical path 350 alongthe lengthwise direction of the electrical path 350 so as to beconnected to the ANT feeding B and C. In addition, the conductive vias305 may be formed in the ground lines 306. Conductive vias 307 lesser insize than the conductive vias 305 may be formed on the right side of theelectrical path 351 so as to prevent contact between the ground linesand a signal line on one side.

An electronic device according to an embodiment of the presentdisclosure includes a housing; a PCB disposed in the housing, the PCBincluding a plurality of layers that include one or more conductivelayers and one or more insulation layers; a first electrical componentformed to be at least a part of the housing or disposed in the housing;a second electrical component disposed above or near the PCB in thehousing, the second electrical component being separated from the firstelectronic component; and at least one electrical path extending fromthe first electrical component to the second electronic component,wherein at least a portion of the electrical path runs on or inside thePCB, wherein the PCB may include a region including a pattern ofconductive vias, each of the vias extending through at least a part ofthe plurality of layers to contact at least one of the one or moreconductive layers, and wherein the electrical path may run through theregion without making contact with the conductive vias.

According to an embodiment of the present disclosure, the firstelectrical component may include an antenna radiator and the secondelectrical component may include a communication circuit.

According to an embodiment of the present disclosure, the antennaradiator may form at least one part of the housing.

According to an embodiment of the present disclosure, the pattern of theconductive vias lit a y be aligned in one or more rows or columns alongthe electrical path when viewed from above the region of the PCB.

According to an embodiment of the present disclosure, the PCB mayinclude an FPCB as at least a part thereof, where the FPCB may transmita signal through the electrical path.

According to an embodiment of the present disclosure, the PCB mayinclude a first PCB; and a second. PCB connected to the first PCBthrough a connector, where the second PCB includes at least one FPCB andat least one rigid PCB, and where the electrical path may transmit ahigh-frequency signal through the connector and may pass over or throughthe second PCB.

According to an embodiment of the present disclosure, the electronicdevice may further include a ground line disposed around the electricalpath so as to be adjacent thereto, where the ground line may beconnected to the one or more conductive layers through the conductivevias in the rigid PCB.

According to an embodiment of the present disclosure, the second PCB mayinclude a first FPCB connected to the first PCB through a communicationcircuit; a second PCB disposed to face the first flexible PCB with aseparation distance therebetween; and a first rigid PCB disposed betweenthe first and second FPCBs, where the first rigid PCB includes thepattern of the conductive vias.

According to an embodiment of the present disclosure, the electronicdevice may further include a second rigid PCB connected to the secondFPCB, wherein a part of the antenna radiator that forms at least oneportion of the housing may be disposed on the second rigid PCB.

According to an embodiment of the present disclosure, at least one ofthe plurality of layers may form a ground pattern in the ground line ofthe second PCB, where the entire line of the ground pattern includes aground.

According to an embodiment of the present disclosure, the conductivevias of the first rigid PCB may include a first conductive via passingthrough all of the plurality of layers; and a second conductive viapassing through sonic of the plurality of layers, and where the firstconductive via may connect the ground pattern disposed on all or some ofthe layers and the ground line.

According to an embodiment of the present disclosure, a plurality ofground lines may be formed on the rigid PCB so as to be spaced apartfrom the electrical path, and may have different widths.

According to an embodiment of the present disclosure, the conductivevias formed along the width of the ground line may include a thirdconductive via having a first hole size; and a fourth via having asecond hole size that differs from the first hole size.

According to an embodiment of the present disclosure, a space formounting an electronic component may be formed on or in the rigid PCB ofthe second PCB.

According to an embodiment of the present disclosure, the connector maybe disposed on one side of the first or second PCB, where the electricalpath passing over or through the second PCB may be connected to thefirst PCB.

According to an embodiment of the present disclosure, the connector mayinclude a first connector disposed on one end of the first FPCB of thesecond PCB; and a second connector disposed on one end of the secondFPCB of the second PCB.

According to an embodiment of the present disclosure, the electronicdevice may include a plurality of electrical paths and a plurality ofantenna radiators, wherein the electrical paths may be connected to therespective antenna radiators corresponding thereto, and the ground linemay be disposed between the plurality of electrical paths.

According to an embodiment of the present disclosure, the first PCB mayinclude at least a part of the first electrical component and may beconnected to the antenna radiator, and the second PCB may have thesecond electrical component disposed thereon.

According to an embodiment of the present disclosure, the FPCB and therigid PCB of the second PCB may be integrated with each other.

According to an embodiment of the present disclosure, the region of thePCB may be a rigid PCB region, and the electronic device may include afirst FPCB region disposed between the first electrical component andthe region; and a second FPCB region disposed between the secondelectrical component and the region.

An electronic device according to an embodiment of the presentdisclosure includes a first PCB; a second PCB connected with the firstPCB through a connector and including at least one FPCB and at least onerigid PCB that are integrated with each other, where the flexible andrigid PCBs include a plurality of layers; an electrical path thattransmits a high-frequency signal through the connector and passes overor through the second PCB; and at least one conductive via disposed inthe rigid PCB to connect grounds between the plurality of layers.

FIG. 14 is a block diagram of an electronic device 10, according to anembodiment of the present disclosure, in a network environment 11.

Referring to FIG. 14, the electronic device 10 may include a bus 180, aprocessor 120, a memory 130, an input/output interface 150, a display160, and a communication interface 170. The electronic device 10 mayomit at least one of the elements, or may further include otherelements.

The bus 180 may include, for example, a circuit that interconnects theelements 120 to 170 and delivers communication (for example, a controlmessage and/or data) between the elements.

The processor 120 may include one or more of a CPU, an AP, and a CR Forexample, the processor 120 may carry out operations or data processingrelating to the control and/or communication of at least one otherelement of the electronic device 10.

The memory 130 may include a volatile and/or non-volatile memory. Forexample, the memory 130 may store instructions or data relevant to atleast one other element 120 to 170 of the electronic device 10. Thememory 130 may store software and/or a program 140. The program 140 mayinclude, for example, a kernel 141, middleware 143, an applicationprogramming interface (API) 145, and/or application programs (orapplications) 147. At least some of the kernel 141, the middleware 143,and the API 145 may be referred to as an operating system (OS).

For example, the kernel 141 may control or manage system resources (forexample, the bus 180, the processor 120, and the memory 130) that areused to execute operations or functions implemented by the otherprograms (for example, the middleware 143, the API 145, and theapplications 147). Furthermore, the kernel 141 may provide an interfaceby which the middleware 143, the API 145, or the applications 147 accessthe individual elements of the electronic device 10 to control or managethe system resources.

For example, the middleware 143 may serve as an intermediary to allowthe API 145 or the applications 147 to exchange data with the kernel 141through communication.

Furthermore, the middleware 143 may process one or more task requestsreceived from the applications 147 according to the priorities of therequests. For example, the middleware 143 may assign, to at least one ofthe applications 147, a priority to use the system resources (forexample, the bus 180, the processor 120, and the memory 130) of theelectronic device 10. For example, the middleware 143 may performscheduling or loading balancing on the one or more task requests byprocessing the one or more task requests according to the priorityassigned to the at least one of the applications.

The API 145 is, for example, an interface by which the applications 147control functions provided by the kernel 141 or the middleware 143, andthe API 145 may include at least one interface or function (for example,an instruction) for file control, window control, image processing, ortext control, for example.

The input/output interface 150 may serve as, for example, an interfacethat can forward instructions or data input from a user or an externaldevice to the other element(s) 120 to 170 of the electronic device 10.Furthermore, the input/output interface 150 may output instructions ordata received from the other element(s) of the electronic device 10 tothe user or the external device.

Examples of the display 160 may include a liquid crystal display (LCD),an LED display, an organic LED (OLED) display, a microelectromechanicalsystems (MEMS) display, and an electronic paper display. For example,the display 160 may display various types of content (for example, text,images, videos, icons, or symbols) for a user. The display 160 mayinclude a touch screen, and may receive, for example, a touch, gesture,a proximity input, or a hovering input using an electronic pen or a partof a user's body.

For example, the communication interface 170 may establish communicationbetween the electronic device 10 and a first external electronic device12, a second external electronic device 11, or a server 16. For example,the communication interface 170 may be connected to a network 162through wireless or wired communication to communicate with the secondexternal electronic device 14 or the server 16.

The wireless communication may use, for example, at least one of longterm evolution (LTE), LTE-advanced (LTE-A), code division multipleaccess (CDMA), wideband CDMA (WCDMA), universal mobiletelecommunications system (UMTS), wireless broadband (WiBro), and globalsystem for mobile communications (GSM), for example, as a cellularcommunication protocol. Furthermore, the wireless communication mayinclude short range communication 164, for example. The short rangecommunication 164 may include, for example, at least one of wirelessfidelity (WiFi), Bluetooth (BT), near field communication (NFC), andglobal navigation satellite system (GNSS). Depending on the service areaand the bandwidth, the GNSS may include, for example, at least one of aglobal positioning system (GPS), a global navigation satellite system(Glonass), a Beidou navigation satellite system (Beidou), and a Europeanglobal satellite-based navigation system (Galileo). Hereinafter, “GPS”may be interchangeably used with “GNSS.” The wired communication mayinclude, for example, at least one of a USB, a high definitionmultimedia interface (HDMI), recommended standard 232 (RS-2 32), and aplain old telephone service (POTS). The network 162 may include at leastone of a communication network such as a computer network (e.g., a localarea network (LAN) or a wide area network (WAN)), the Internet, and atelephone network.

Each of the first and second external electronic devices 12 and 14 maybe of the same or a different type from the electronic device 10.According to an embodiment of the present disclosure, the server 16 mayinclude a group of one or more servers. All or some of the operationsexecuted in the electronic device 10 may be executed in the electronicdevice 102, the electronic device 104, or the server 16. When theelectronic device 10 must perform a function or service automatically orin response to a request, the electronic device 10 may request theelectronic device 12, the electronic device 14, or the server 16 toperform at least some functions relating thereto, instead of or inaddition to performing the function or service by itself. The electronicdevice 102, the electronic device 104, or the server 106 may execute therequested function or additional functions and then deliver the resultto the electronic apparatus 10. The electronic device 10 may provide areceived result as is, or may further process the received result toprovide the requested function or service. To this end, for example,cloud computing, distributed computing, or client-server computingtechnology may be used.

The electronic device 10, which is described below in greater detail,may be one of a wearable device, a notebook computer, a net-bookcomputer, a smart phone, a tablet PC, a Galaxy tab, an i-Pad, and awireless charging device mentioned above. In this embodiment, theelectronic device 10 may be a smart phone.

The wireless charging device, according to an embodiment of the presentdisclosure, refers to a device that recharges the electronic device bywirelessly transmitting and receiving power in a short range.

In addition, the display 160 of the electronic device 10 may increase insize and may implement a luxurious design by minimizing the bezel areathereof, or may be implemented to be flexible, convex, or concave.

Namely, the peripheral portion of the display 160 may he bent to allow aview area to extend to the lateral portion. As the view area of thedisplay 160 is bent to extend to the lateral, the view area may beenlarged, a separate screen may be used on the lateral portion, or aluxurious design may be implemented. In other words, the display 160 mayinclude a first view area and second view areas on opposite sides of thefirst view area.

FIG. 15 is a block diagram of an electronic device 1901 according to anembodiment of the present disclosure. The electronic device 1901 mayinclude, for example, the entirety or a part of the electronic device 10described above with reference to FIG. 14. The electronic device 1901 inFIG. 15 may include at least one processor (e.g., an AP) 1910, acommunication module 1920, a subscriber identification module card 1924,a memory 1930, a sensor module 1940, an input device 1950, a display1960, an interface 1970, an audio module 1980, a camera module 1991, apower management module 1995, a battery 1996, an indicator 1997, and amotor 1998.

The processor 1910 may operate, for example, an OS or an applicationprogram to control a plurality of hardware or software elementsconnected to the processor 1910 and to perform various types of dataprocessing and operations. The processor 1910 may be implemented to be asystem on chip (SoC), for example. According to an embodiment of thepresent disclosure, the processor 1910 may further include a graphicsprocessing unit (GPU) and/or an image signal processor. The processor1910 may also include at least some (for example, a cellular module1921) of the elements illustrated in FIG. 15. The processor 1910 mayload, in a volatile memory, instructions or data received from at leastone of the other elements (for example, a non-volatile memory) toprocess the loaded instructions or data, and may store various types ofdata in the non-volatile memory.

The configuration of the communication module 1920 may be the same as orsimilar to that of the communication interface 170 of FIG. 14. Thecommunication module 1920 may include, for example, a cellular module1921, a WIN module 1923, a BT module 1925, a GNSS module 1927 (forexample, a GPS module, a Glonass module, a Beidou module, or a Galileomodule), an NFC module 1928, and an RF module 1929.

The cellular module 1921 may provide, for example, a voice call, a videocall, a text message service, or an Internet service through acommunication network. According to an embodiment of the presentdisclosure, the cellular module 1921 may identify and authenticate theelectronic device 1901 in a communication network using the subscriberidentification module card (SIM card) 1924. The cellular module 1921 mayperform at least some of the functions that the processor 1910 canprovide. The cellular module 1921 may include a CP.

The WiFi module 1923, the BT module 1925, the GNSS module 1927, and theNFC module 1928 may each include, for example, a processor forprocessing data transmitted and received through the correspondingmodule. According to an embodiment of the present disclosure, at leastsome (for example, two or more) of the cellular module 1921, the WiFimodule 1923, the BT module 1925, the GNSS module 1927, and the NFCmodule 1928 may be included in one integrated circuit (IC) or ICpackage.

The RF module 1929 may transmit and receive, for example, acommunication signal (for example, an RF signal). The RF module 1929 mayinclude, for example, a transceiver, a power amplifier module (PAM), afrequency filter, a low noise amplifier (LNA), or an antenna. At leastone of the cellular module 1921, the WiFi module 1923, the BT module1925, the GNSS module 1927, and the NFC module 1928 may transmit andreceive an RF signal through a separate RF module.

The subscriber identification module card 1924 may include, for example,an embedded SIM, and may include unique identification information (forexample, an integrated circuit card identifier (ICCID)) or subscriberinformation (for example, an international mobile subscriber identity(IMSI)).

The memory 1930 (for example, the memory 130 in FIG. 14) may include,for example, an internal memory 1932 or an external memory 1934. Theinternal memory 1932 may include, for example, at least one of avolatile memory (for example, a dynamic random access memory (DRAM), astatic RAM (SRAM), or a synchronous DRAM (SDRAM)) and a non-volatilememory (for example, a one-time programmable read only memory (OTPROM),a programmable ROM (PROM), an erasable and programmable ROM (EPROM), anelectrically erasable PROM (EEPROM), a mask ROM, a flash ROM, a flashmemory (for example, a NAND flash memory or a NOR flash memory), a harddisc drive, or a solid state drive (SSD)).

The external memory 1934 may further include a flash drive, which maybe, for example, a compact flash (CF) drive, a secure digital (SD)memory card, a micro SD (Micro-SD) memory card, a a mini SD (Mini-SD)memory card, an extreme digital (xD) memory card, a multi-media card(MMC), or a memory stick. The external memory 1934 may be functionallyand/or physically connected to the electronic device 1901 throughvarious interfaces.

For example, the sensor module 1940 may measure a physical quantity, ormay sense an operating state of the electronic device 1901, to convertthe measured or sensed information into an electrical signal. The sensormodule 1940 may include, for example, at least one of a gesture sensor1940A, a gyro sensor 1940B, an atmospheric pressure sensor 1940C, amagnetic sensor 1940D, an acceleration sensor 1940E, a grip sensor1940F, a proximity sensor 1940G, a color sensor 1940H (for example, ared, green, blue (RGB) sensor), a biometric sensor 1940I, atemperature/humidity sensor 1940J, an illuminance sensor 1940K, and aultraviolet (UV) light sensor 1940M. Additionally or alternatively, thesensor module 1940 may include, for example, an electronic nose (E-nose)sensor, an electromyography (EMG) sensor, an electroencephalogram (EEG)sensor, an electrocardiogram (ECG) sensor, an infrared (IR) sensor, aniris sensor, and/or a fingerprint sensor. The sensor module 1940 mayfurther include a control circuit for controlling one or more sensorsincluded therein, In an embodiment of the present disclosure, theelectronic device 1901 may further include a processor configured tocontrol the sensor module 1940 as a part of the processor 1910 orseparately from the processor 1910 to control the sensor module 1940while the processor 1910 is in a reduced power or sleep state.

The input device 1950 may include, for example, a touch panel 1952, a(digital) pen sensor 1954, a key 1956, or an ultrasonic input device1958. The touch panel 1952 may use, for example, at least one of acapacitive type panel, a resistive type panel, an infrared type panel,and an ultrasonic type panel. Furthermore, the touch panel 1952 mayfurther include a control circuit. The touch panel 1952 may furtherinclude a tactile layer to provide a tactile reaction to a user.

The (digital) pen sensor 1954 may include, for example, a recognitionsheet that is a part of, or separate from, the touch panel. The key 1956may include, for example, a physical button, an optical key, or akeypad. The ultrasonic input device 1958 may sense ultrasonic wavesgenerated by an input tool through a microphone 1988 and may identifydata corresponding to the sensed ultrasonic waves.

The display 1960 (for example, the display 160 in FIG. 14) may include apanel 1962, a hologram device 1964, or a projector 1966. The panel 1962may have a configuration that is the same as, or similar to, that of thedisplay 160 illustrated in FIG. 1. The panel 1962 in FIG. 15 may beimplemented to be, for example, flexible, transparent, or wearable. Thepanel 1962, together with the touch panel 1952, may be implemented to beone module. The hologram device 1964 may show a three-dimensional imagein the air by using an interference of light. The projector 1966 mayproject light onto a screen to display an image. The screen may belocated, for example, inside or outside of the electronic device 1901.According to an embodiment of the present disclosure, the display 1960may further include a control circuit for controlling the panel 1962,the hologram device 1964, and the projector 1966.

The interface 1970 may include, for example, an EIDMI 1972, a USB 1974,an optical interface 1976, or a D-subminiature (D-sub) connector 1978.The interface 1970 may be included, for example, in the communicationinterface 170 illustrated in FIG. 3. Additionally or alternatively, theinterface 1970 in FIG. 15 may include, for example, a mobilehigh-definition link (MHL) interface, an SD card/MMC interface, or anInfrared Data Association (IrDA) standard interface.

For example, the audio module 1980 may convert a sound into anelectrical signal, and vice versa. At least some elements of the audiomodule 1980 may be included, for example, in the input/output interface145 illustrated in FIG. 1. The audio module 1980 in FIG. 15 may processsound information that is input or output, for example, through aspeaker 1982, a receiver 1984, an earphone 1986, or the microphone 1988.

The camera module 1991 is a device that can photograph a still image anda dynamic image. According to an embodiment of the present disclosure,the camera module 1991 may include one or more image sensors (forexample, a front sensor or a rear sensor), a lens, an image sensorprocessor (ISP), or a flash (for example, an LED or a xenon lamp).

The power management module 1995 may manage, for example, power of theelectronic device 1901. According to an embodiment of the presentdisclosure, the power management module 1995 may include a powermanagement IC (PMIC), a charger IC, or a battery gauge. The PMIC may usea wired and/or wireless charging method. Examples of the wirelesscharging method may include a magnetic resonance method, a magneticinduction method, and an electromagnetic wave method. An additionalcircuit (for example, a coil loop, a resonance circuit, or a rectifier)for wireless charging may be further included. The battery gauge maymeasure, for example, a residual amount of the battery 1996 and avoltage, current, or temperature while charging. The battery 1996 mayinclude, for example, a rechargeable battery and/or a solar battery

The indicator 1997 may indicate a particular state (for example, abooting state, a message state, or a charging state) of the electronicdevice 1901 or a part thereof (for example, the processor 1910). Themotor 1998 may convert an electrical signal into a mechanical vibrationand may generate a vibration or a haptic effect. The electronic device1901 may include a processing unit (for example, a GPU) for supportingmobile TV. The processing unit for supporting mobile TV may processmedia data. according to a standard., such as digital multimediabroadcasting (DMB), digital video broadcasting (DVB), or MediaFlo™.

Each of the above-described component elements of hardware according tothe present disclosure may be configured with one or more components,and the names of the corresponding component elements may vary based onthe type of electronic device. The electronic device according tovarious embodiments of the present disclosure may include at least oneof the aforementioned elements. Some elements may be omitted or otheradditional elements may be further included in the electronic device. Inaddition, some of the hardware components according to variousembodiments may be combined into one entity, which may perform functionsidentical to those of the relevant components before the combination.

While the present disclosure has been shown and described with referenceto certain embodiments thereof, it will be apparent to those skilled inthe art that the camera lens module according to the present disclosureis not limited to these embodiments, and various changes in form anddetails may be made therein without departing from the scope of thepresent disclosure as defined by the appended claims and theirequivalents.

What is claimed is:
 1. An electronic device comprising: a firstcomponent; a second component; and a signal path interface coupledbetween the first component and the second component, the signal pathinterface including a printed circuit board (PCB) having a rigid PCBportion and a flexible PCB portion, wherein a first signal line and asecond signal line extend through the rigid PCB portion and the flexiblePCB portion for transmitting signals from the first component to thesecond components, and a plurality of ground lines extend through therigid PCB portion and the flexible PCB portion, and wherein each of theplurality of ground lines extending through the rigid PCB portion isconnected to one or more conductive layers through conductive vias. 2.The electronic device of claim 1, wherein the first component comprisesa communication module, and the second component comprises an antennaradiator, and wherein the first signal line and the second signal lineextending through the signal path interface are configured to transmithigh-frequency signals from the communication module to the antennaradiator.
 3. The electronic device of claim 2, wherein the plurality ofground lines include a first ground line, a second ground line at leastpartially spaced apart from the first ground line, and a third groundline located between the first signal line and the second signal line,wherein first signal line is located between the first ground line andthe second ground line, and wherein the second signal line is locatedbetween the first signal line and the second ground line.
 4. Theelectronic device of claim 2, wherein the PCB includes an insulatinglayer on which the first ground line, the second ground line, the thirdground line, the first signal line, and the second signal line arelocated, and a ground plate located below the insulating layer.
 5. Theelectronic device of claim 4, wherein the ground plate is electricallyconnected with the first ground line through a first conduction viaformed in a first portion of the insulating layer, the second groundline through a second conduction via formed. in a second portion of theinsulating layer, and the third ground line through a third conductionvia formed in a third portion of the insulating layer.